The RE-7500 System is the very same one we use` and makes "mounting/removal of through-hole and surface mount components easier than routine bench top methods" and "minimizes thermal stresses due to temperature differentials during assembly and rework" and "enables the mounting of BGA's and other hidden pin packages on site.”
Don't be fooled by other companies using IR systems that might repair the PCB temporarily, but that can actually do more harm than good to the board and chips. You want complete re flow of then entire ball of solder on every connection, not just tangential re flow that can open up again if the board flexes.